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Copper Ink as Seed Layer for 3D Copper Plating

Magdassi Shlomo, HUJI, Faculty of Science, The Institute of Chemistry

Category

Nanotechnology    

Keywords

3D printing, bi-nuclear copper complex , catalyst

Current development stage

TRL4 Technology validated in lab            

Application

  • 3D printed electronics enables fabrication of 3D devices with embedded or conformal electronic circuits.
  • Patterning of electrical conductors and electronic components on and within 3D objects is extremely challenging, and usually involves electroless or electrolytic deposition processes that require the use of very costly catalyst, usually palladium, as a seed material.

Our Innovation

An innovative approach that use bi-nuclear copper complex, as a very efficient replacement for the conventional catalysts, that can be directly inkjet printed onto 3D plastic objects.

  • Low cost solution which replace the expensive catalysts, such as palladium in the plating processes.
  • Lower resistivity
  • Better conductivity

Technology

  • By combining the bi-nuclear complex with electroless plating, very low resistivity which corresponds to a high conductivity of bulk copper, was obtained
  • In the printing process, after the printing itself, the copper complex is converted to pure copper upon short exposure to low temperature plasma.
  • The applicability of the complex ink and the process was demonstrated in fabrication of a Near Field Communication (NFC) antenna on a 3D printed plastic object.

Opportunity

  • 3D printed electronics
  • Variety of applications, such as in Internet of Things (IoT), medical devices and robotics
  • Plating industry

Contact for more information:

Matt Zarek
SCOUTING, IDEATION, AND TECHNOLOGY EVALUATION
+972-2-6586686
Contact ME:
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